1. Expand the crystal, open the densely arranged chips a little bit to facilitate the crystal bonding.
2. Die-bonding, point conductive/non-conductive glue on the bottom of the bracket (conductivity depends on whether the chip is a top-down PN junction or a left-right PN junction) and then put the chip into the bracket.
3. Short bake, so that the chip does not move when the glue is cured.
4. Wire bonding, use gold wire to connect the chip and the support.
5. Pre-test, preliminary test whether it can be bright.
6. Fill the glue and wrap the chip and bracket with glue.
7. Long bake, let the glue solidify.
8. Post-test, test whether it can be bright or not and whether the electrical parameters meet the standard.
9. Light and color separation to separate products with roughly the same color and voltage.
10. Packaging.
